Intel
2 Locations · On-site · Full-time
Advanced Packaging Process Integration Engineer
Posted 8 days ago
- Location
- 2 Locations
- Work mode
- On-site
- Employment
- Full-time
- Experience
- Mid-level
- Education
- master's
Requirements
- Experience with advanced packaging process integration
- Strong failure analysis/root cause skills
Skills
- electronics manufacturing
- statistical process control
- six sigma
- root cause analysis
- cleanroom
About the company
Intel
Posted via Workday_ats
How to apply
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