Head of Device Fabrication, Advanced Packaging and Assembly | Rozgoo | Rozgoo

Universal Quantum

Singapore, SG · On-site · Full-time

Head of Device Fabrication, Advanced Packaging and Assembly

Posted 11 days ago

Location: Singapore, SG
Work mode: On-site
Employment: Full-time
Experience: Lead · 7+ yrs
Education: master's

About the role

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At Universal Quantum, we are building the next generation of quantum computers - machines capable of solving problems once thought impossible. Our technology has the potential to transform industries from healthcare to aerospace, materials science, and beyond. As we scale from breakthrough R&D to global delivery, resilient execution becomes as critical as technical innovation. The Head of Device Fabrication, Advanced Packaging and Assembly is accountable for the development, industrialisation, …

Requirements

Experience in device fabrication and advanced packaging
Leadership in managing manufacturing processes
Expertise in quantum computing or related technologies
Experience scaling manufacturing from R&D to production

Skills

device fabrication
advanced packaging
assembly
quantum computing
industrialisation
process development
team leadership
healthcare
aerospace
materials science
scaling manufacturing
innovation management

About the company

Universal Quantum

Posted via Adzuna

How to apply

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Universal Quantum

Head of Device Fabrication, Advanced Packaging and Assembly