Head of Device Fabrication, Advanced Packaging and Assembly | Rozgoo | Rozgoo

Universal Quantum Ltd.

Singapore, SG · On-site · Full-time

Head of Device Fabrication, Advanced Packaging and Assembly

₹1.7L – ₹3.2LPosted 10 days ago

Location: Singapore, SG
Work mode: On-site
Employment: Full-time
Salary: ₹1.7L – ₹3.2L
Experience: Lead · 7+ yrs
Education: master's

© 2026 Rozgoo

About the role

At Universal Quantum, we are building the next generation of quantum computers - machines capable of solving problems once thought impossible. Our technology has the potential to transform industries from healthcare to aerospace, materials science, and beyond. As we scale from breakthrough R&D to global delivery, resilient execution becomes as critical as technical innovation. The Head of Device Fabrication, Advanced Packaging and Assembly is accountable for the development, industrialisation, …

Requirements

7+ years in device fabrication or advanced packaging
Master's degree in engineering or related field
Experience in advanced manufacturing technologies
Strong leadership and project management skills
Background in quantum or semiconductor technologies
Excellent communication and teamwork

Skills

device fabrication
advanced packaging
assembly
quantum computing
industrialisation
technical innovation
leadership
global delivery
r&d
process development

About the company

Universal Quantum Ltd.

Posted via Adzuna

How to apply

Apply Now takes you to Rozgoo, where auto-apply can submit your application for this role. Updated 9 days ago.

Universal Quantum Ltd.

Head of Device Fabrication, Advanced Packaging and Assembly

₹1.7L – ₹3.2L