- Location
- Yishun, SG
- Work mode
- On-site
- Employment
- Full-time
- Experience
- Mid-level
About the role
Singapore-Yishun Full time R027022 Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be …
Requirements
- experience with package design for flip-chip bga
- experience with high-speed serdes
- knowledge of rf/microwave communications
- experience with adc/dac packaging for asics
Skills
- flip-chip bga
- package design
- asic
- serdes
- rf microwave
- adc dac
- bga
- high-speed design
- microwave communications
About the company
Broadcom
Posted via Adzuna
How to apply
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