- Location
- Bangalore, IN
- Work mode
- On-site
- Employment
- Full-time
- Experience
- Mid-level · 4+ yrs
About the role
Role Overview TYLsemi is seeking a Package Design Engineer to own design of IC packages (flip-chip, wirebond and 2.5D/interposer platforms) for high-speed digital and data-center-class products. The successful candidate will drive package design from bump/ball map definition through substrate stack-up, routing, signal/power integrity closure, and tapeout — working closely with SI/PI, silicon design, and test engineering to deliver package designs that are robust against real silicon feedback. W…