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Wanco Manpower Pte Ltd
Singapore, SG · On-site · Full-time
Research Engineer, Advanced Packaging & 3D Integration
New₹68K – ₹91KPosted 1 hour ago
- Location
- Singapore, SG
- Work mode
- On-site
- Employment
- Full-time
- Salary
- ₹68K – ₹91K
- Experience
- Mid-level
About the role
Wanco Manpower Pte Ltd is recruiting engineers for multiple opportunities in advanced semiconductor packaging and process integration. The role focuses on developing and optimizing process integration flows for fan-out wafer-level packaging, 2.5D/3D interconnects and heterogeneous integration. You will work across lithography, deposition, plating, etching, CMP, RDL, bumping, thinning and bonding, while evaluating upstream/downstream interactions to boost yield and reliability. J-18808-Ljbffr
About the company
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Wanco Manpower Pte Ltd
Posted via Adzuna
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