Senior/ Staff NPI Wafer Bumping/Fan-Out Process Engineer | Rozgoo | Rozgoo

Lumilens

Singapore, SG · On-site · Full-time

Senior/ Staff NPI Wafer Bumping/Fan-Out Process Engineer

₹68K – ₹1.0LPosted 1 month ago

Location: Singapore, SG
Work mode: On-site
Employment: Full-time
Salary: ₹68K – ₹1.0L
Experience: Lead · 5+ yrs

About the role

© 2026 Rozgoo

Core Responsibilities Lead the process development and technical support of the wafer bumping, and/or Fan-Out process for silicon photonic chip wafers Process Pathfinding & Integration: Design and optimize early-stage process flows for wafer bumping, thin-film sputtering, lithography, electroplating, and ball drop execution. DOE to characterize process window and margin. Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including dielectric photoresist…

Requirements

process engineering experience in wafer-level packaging
hands-on knowledge of sputtering, lithography, electroplating, ball drop
ability to run DOE and characterize process windows
experience with silicon photonics process flows

Skills

wafer bumping
fan-out process
process development
process integration
thin-film sputtering
lithography
electroplating
ball drop execution
technical support
early-stage process pathfinding
margin/process optimization

About the company

Lumilens

Posted via Adzuna

How to apply

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Lumilens

Senior/ Staff NPI Wafer Bumping/Fan-Out Process Engineer

₹68K – ₹1.0L