- Location
- India
- Work mode
- On-site
- Employment
- Full-time
- Experience
- Mid-level · 5+ yrs
- Education
- master's
Requirements
- silicon/IC packaging design experience
- knowledge of reliability/DFR concepts
- electronics/mechanical design fundamentals
Skills
- silicon packaging
- ic packaging
- design for reliability
- thermal analysis
- mechanical/electrical co-design
- electronics design
- cad tools
- ansys
- solidworks
About the company
Intel
Posted via Workday_ats
How to apply
Apply Now takes you to Rozgoo, where auto-apply can submit your application for this role. Updated 4 days ago.
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