Staff/Principal Engineer, APTD CEM - Advanced Packaging Die… | Rozgoo | Rozgoo

Micron

Singapore, SG · On-site · Full-time

Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Posted 23 days ago

Location: Singapore, SG
Work mode: On-site
Employment: Full-time
Experience: Lead · 8+ yrs
Education: bachelor's

About the role

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Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are purs…

Requirements

Bachelor's degree in Electrical or Materials Engineering
8+ years experience in advanced packaging or semiconductor engineering
Expertise in die level technology
Strong problem-solving and innovation skills
Experience working with neural networks or virtual reality technologies
Ability to lead complex engineering projects
Excellent communication and teamwork skills

Skills

advanced packaging
die level technology
engineering
innovation
neural networks
virtual reality

About the company

Micron

Posted via Adzuna

How to apply

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Micron

Staff/Principal Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering