Syenta
Eveleigh, AU · Remote · Full-time
Substrate IC Package Design Engineer – Remote
Posted 1 month ago
- Location
- Eveleigh, AU
- Work mode
- Remote
- Employment
- Full-time
- Experience
- Mid-level · 0+ yrs
About the role
About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Metallization (LEM) technology. Our platform enables advanced packaging by combining patterning and metallisation into a single tool. We achieve high-speed, high-resolution metallisation at significantly lower cost and energy use, while minimizing emissions and waste. Founded in Australia, we are building a world-class team tackling some of the toughest challenges in semi…
Requirements
- IC package design experience
- semiconductor packaging knowledge
- familiarity with electrochemical metallization/LEM
Skills
- ic package design
- semiconductor packaging
- electrochemical metallization
- lem technology
- remote collaboration
- high-speed metallisation
About the company
Syenta
Posted via Adzuna
How to apply
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